In recent years, the rapid development of electronic technology, with the electronic devices of high-frequency, high-speed and integrated circuit-intensive and miniaturization, modular assembly, electronic components per unit volume of heat increased rapidly. The normal operating temperature range of the electronic device is generally - 5 ~ +65 ℃, beyond this range, the component performance will be significantly reduced, can not work steadily, thus affecting the reliability of system operation. The temperature of a single semiconductor element is reduced by 50% for every 10 ° C increase in temperature. Therefore, it is very important to solve the problem of heat dissipation of industrial cabinets, and it is very important to produce cabinet cooling devices with high structure, reliable performance, flexible installation and high heat dissipation efficiency. The application of heat pipe technology to the dissipation of power electronic components is one of the fastest growing areas in the world. In the United States, Japan and other developed countries, large heat to kilowatt-class devices (high-power thyristors, IGBT modules), small to a few watts of microelectronic components (large-scale integrated circuits in notebook computers) are widely used heat pipe radiator, Its amount has reached millions of sets per year. The following figure for my company developed for high-voltage inverter high-power IGBT module heat pipe heat sink radiator.